<ol id="klknb"><blockquote id="klknb"></blockquote></ol>
    <strong id="klknb"></strong>

    <track id="klknb"><i id="klknb"></i></track>

  1. <optgroup id="klknb"><i id="klknb"></i></optgroup>
    <acronym id="klknb"></acronym>

  2. 淘豆網
    下載此文檔放大查看縮小查看   1/285
    0/100
    您的瀏覽器不支持進度條
    更多>>該用戶其他文檔
    下載所得到的文件列表
    High Thermal Conductivity Materials教材.pdf
    文檔介紹:
    High Thermal Conductivity Materials
    Subhash L. Shind´e
    Jitendra S. Goela
    Editors
    High Thermal
    Conductivity Materials
    With 133 Illustrations
    Editors
    Subhash L. Shind´e(Ed.) Jitendra S. Goela (Ed.)
    Sandia National Labs. Rohm and Haas Advanced Materials
    P.O. Box 5800, MS 0603 185 New Boston Street
    Albuquerque, NM 87185 Woburn, MA 01801
    USA USA
    slshind@sandia.gov jgoela@
    Library of Congress Cataloging-in-Publication Data
    Shind´e, Subhash L.
    High thermal conductivity materials / Subhash L. Shind´e,Jitendra S. Goela.
    p. cm.
    Includes bibliographical references and index.
    ISBN 0-387-22021-6 (alk. paper)
    1. Heat--Conduction. 2. Materials--Thermal properties. I. Shind´e, Subhash L. Goela,
    Jitendra S. II. Title.
    QC321.S44 2004
    536.2012—dc22 2004049159
    ISBN-10: 0-387-22021-6 e-ISBN-: 0-387-25100-6
    ISBN-13: 978-0387-22021-5
    Printed on acid-free paper.
    c 2006 Springer Science+Business Media, Inc.
    All rights reserved. This work may not be translated or copied in whole or in part without
    the written permission of the publisher (Springer Science+Business Media, Inc., 233 Spring
    Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews
    or scholarly analysis. Use in connection with any form of information storage and retrieval,
    electronic adaptation, computer software, or by similar or dissimilar methodology now
    known or hereafter developed is forbidden.
    The use in this publication of trade names, trademarks, service marks, and similar terms,
    even if they are not identi?ed as such, is not to be taken as an expression of opinion as to
    whether or not they are subject to proprietary rights.
    Printed in the United States of America. (SBA/Techset)
    987654321

    In loving Memory of
    Dr. Bhagwat Sahai Verma (1920–2005),
    Retired Dean of Engineering,
    Banaras Hindu University,
    Varanasi, India
    Preface
    The demand for e?cient thermal management has increased substantially over
    the last decade in every imaginable area, be it a formula 1 racing car suddenly
    braking to decelerate from 200 to 50 mph going around a sharp corner, a
    space shuttle entering the earth’s atmosphere, or an advanced microproces-
    sor operating at a very high speed. The temperatures at the hot junctions
    are extremely high and the thermal ?ux can reach values higher than a few
    hundred to a thousand watts/cm2 in these applications. To take a speci?c
    example of the microelectronics area, the chip heat ?ux for CMOS micropro-
    cessors, though pared to the numbers mentioned above have
    already reached values close to 100 W/cm2, and are projected to increase
    above 200 W/cm2 over the next few years. Although the thermal manage-
    ment strategies for microprocessors do involve power optimization through
    improved design, it is extremely di?cult to eliminate “hot spots” completely.
    This is where high thermal conductivity materials ?nd most of their applica-
    tions, as “ 內容來自淘豆網www.y9221.com轉載請標明出處.
    5月丁香