High Thermal Conductivity Materials教材.pdf
High Thermal Conductivity Materials
Subhash L. Shind´e
Jitendra S. Goela
With 133 Illustrations
Subhash L. Shind´e(Ed.) Jitendra S. Goela (Ed.)
Sandia National Labs. Rohm and Haas Advanced Materials
P.O. Box 5800, MS 0603 185 New Boston Street
Albuquerque, NM 87185 Woburn, MA 01801
Library of Congress Cataloging-in-Publication Data
Shind´e, Subhash L.
High thermal conductivity materials / Subhash L. Shind´e,Jitendra S. Goela.
Includes bibliographical references and index.
ISBN 0-387-22021-6 (alk. paper)
1. Heat--Conduction. 2. Materials--Thermal properties. I. Shind´e, Subhash L. Goela,
Jitendra S. II. Title.
ISBN-10: 0-387-22021-6 e-ISBN-: 0-387-25100-6
Printed on acid-free paper.
c 2006 Springer Science+Business Media, Inc.
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Printed in the United States of America. (SBA/Techset)
In loving Memory of
Dr. Bhagwat Sahai Verma (1920–2005),
Retired Dean of Engineering,
Banaras Hindu University,
The demand for e?cient thermal management has increased substantially over
the last decade in every imaginable area, be it a formula 1 racing car suddenly
braking to decelerate from 200 to 50 mph going around a sharp corner, a
space shuttle entering the earth’s atmosphere, or an advanced microproces-
sor operating at a very high speed. The temperatures at the hot junctions
are extremely high and the thermal ?ux can reach values higher than a few
hundred to a thousand watts/cm2 in these applications. To take a speci?c
example of the microelectronics area, the chip heat ?ux for CMOS micropro-
cessors, though pared to the numbers mentioned above have
already reached values close to 100 W/cm2, and are projected to increase
above 200 W/cm2 over the next few years. Although the thermal manage-
ment strategies for microprocessors do involve power optimization through
improved design, it is extremely di?cult to eliminate “hot spots” completely.
This is where high thermal conductivity materials ?nd most of their applica-
tions, as “